I talked with Abhijeet Chakraborty, Vice President Engineering at Synopsys, about multi-die ICs and where chiplets are headed (watch video above). Synopsys has been at the forefront of chiplet designs with tools like its 3DIC Compiler (see figure). Abhijeet addresses questions about securing the chiplet supply chain as well as how artificial intelligence (AI) affects the tools and system designs.
The 3DIC Compiler combines many of Synopsys’ tools, such as RedHawk-SC, RedHawk-SC Electrothermal, and Ansys HFSS-IC. These provide “automation and optimizations for multiphysics analysis including power and signal integrity, thermal, and mechanical stress.” The AI capabilities of the compiler are used to improve development times as well as optimize the system design. It’s certified by major foundries.
Read more about the 2026 Chiplet Summit
Santa Clara Convenction Center | Chiplet Summit
Check out the breaking news, videos, and podcasts coming from this year’s Chiplet Summit.
William Wong | Santa Clara Convention Center
Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.
