The Impress Co-Packaged Copper Solutions from Molex use a compression-based substrate connector and mating cable assembly to support data rates up to 224Gbps PAM-4 for AI and hyperscale data center systems. The two-piece connector mounts directly to the ASIC package substrate to shorten signal paths, reduce PCB trace length and improve signal integrity while enabling rework and upgrades without damaging the substrate. Designed for 224G architectures with development toward 336G and 448G, the solution targets high-speed server and networking platforms requiring dense copper interconnects.
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