Siemens has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analogue semiconductor development capabilities. With this move, Toshiba aims to strengthen its position as a leader in semiconductor innovation and accelerates the development of next-generation power devices and analogue semiconductors that meet the highest standards of performance and reliability.
“Toshiba has introduced Siemens’ EDA tools to advance semiconductor design sophistication and accelerate development speed and we have begun trials to strengthen our design environment using these tools, aiming to improve design accuracy in analogue–digital co-design, streamline verification processes, and improving development workflows,” said Yoshinari Ojima, Senior Manager of Toshiba’s Design Engineering Development Department, IC Development Centre. “Through these efforts, we will further reinforce the quality and reliability we have already established, not only in power devices and analogue semiconductors but also in digital and mixed-signal semiconductors. Building on our long-cultivated proprietary technological expertise, Toshiba will drive innovative semiconductor development that meets market needs through collaboration with these EDA tools.”
“We are delighted that Toshiba has introduced a broad range of our EDA software for its power device and analogue semiconductor development design flows,” said Yukio Tsuchida, vice president for Japan, Siemens EDA, Siemens Digital Industries Software. “We look forward to supporting Toshiba on its journey to enhanced design excellence and to help it to deliver transformational change in its design processes with the power, precision and performance of Siemens’ EDA technology.”
Toshiba’s deployment of Siemens’ world class EDA tools includes:
Advanced thermal design and analysis for 3D IC architectures
Toshiba has introduced Siemens’ advanced technologies to address thermal challenges unique to 3D IC architectures. The company is currently utilising the Innovator3D IC solution suite, which enables efficient creation, simulation, and management of heterogeneously integrated 2.5D/3D IC designs, along with Calibre 3DThermal software to consider establishing an integrated chip-package thermal co-design flow that spans from early feasibility analysis through to final sign-off. Through these initiatives, Toshiba aims to optimise package design and further enhance product reliability with precise thermal modelling.
Power optimisation, integrity and reliability enhancement
Using Siemens’ Insight Analyzer and mPower Analog EMIR software, Toshiba plans to conduct advanced leakage current optimisation, precise Electromigration and IR-drop (EMIR) verification, and enhanced power efficiency validation, all of which improves device reliability. Toshiba will also use Siemens’ PowerPro Designer software earlier in the flow to analyse and optimize its RTL to minimise power consumption.
Next-generation analogue simulation acceleration
Toshiba is leveraging Siemens’ Solido Simulation Suite to work toward improving the efficiency of analogue and mixed-signal design verification and enhance the accuracy of simulation work. In addition, Toshiba is utilising the AI capabilities of Siemens’ Solido Design Environment software to perform variation simulations and advanced statistical analyses, with the goal of strengthening the overall robustness of its designs.
